The unit presents the specificities of the microelectronics industry and the main risks linked to the industry, explaining succinctly the characteristics of a microelectronic chip and forms of packaging. It then deals with general notions of reliability and “design for reliability”.
The practical application for the life cycle estimation of electronic components is based on real reliability trials, dealing with the phenomenon of electromigration.
| On completion of the unit, the student will be capable of: | Classification level | Priority |
|---|---|---|
| Understanding the specificities of the microelectronics industry and associated risks. | 2. Understand | Essential |
| Understanding the main manufacturing phases of a micro-chip and its packaging | 2. Understand | Important |
| Understanding and implementing a reliability test and determining a life cycle. | 6. Assess | Important |
| Understanding the issues related to design for reliability | 1. Knowledge | Important |
| Percentage ratio of individual assessment | Percentage ratio of group assessment | ||||
|---|---|---|---|---|---|
| Written exam: | 100 | % | Project submission: | % | |
| Individual oral exam: | % | Group presentation: | % | ||
| Individual presentation: | % | Group practical exercise: | % | ||
| Individual practical exercise: | % | Group report: | % | ||
| Individual report: | % | ||||
| Other(s): % | |||||
| Type of teaching activity | Content, sequencing and organisation |
|---|---|
| Course | Specificities of the microelectronics industry and associated risks. |
| Supervised studies | Undertaking reliability tests, using experimental data and extracting an estimation of the life cycle. |